V plnom prietoku: Vďaka úzkemu priemeru sa cín ľahko dávkuje a je ideálny na presnú prácu, napr. na spájkovanie elektrických súčiastok a zariadení, ako sú dosky plošných spojov, SMD, DIP, káble, televízory, slúchadlá alebo mikrofóny. Integrované tavidlo bez čistenia je obzvlášť pohodlné, pretože ho po spájkovaní nemusíte zo spoja odstraňovať.
| Zloženie | 99 % cínu, 0,3 % striebra, 0,7 % medi |
| Jednotka spotreby | 1 ks voľne ložené |
| Priemer | 1 mm |
| Obsah toku | 2,5 |
| Bod topenia | 217 °C |
| Typ balenia | Hromadné |
| Hmotnosť | 100 g |
In full flow: With its narrow diameter, the tin is easy to dispense and ideal for precision work, e.g. for soldering electrical components and devices such as printed circuit boards, SMDs, DIPs, cables, televisions, headphones or microphones. The integrated no-clean flux is particularly convenient, as you do not need to remove it from the joint after soldering.
- Flux-filled solder wire with a diameter of 1 mm, ideal e.g. for soldering electronics
- Simple, homogeneous wetting of the solder joint thanks to the rosin flux core
- No-clean solution with continuous flux cores that does not require cleaning the solder joint after use
- Reduced spattering for increased user safety and protection of the workpiece
- Halogen-free and with low smoke emission
- Perfect for soft soldering at low temperatures up to 450 °C in the automated and hand soldering area
Technical specifications
| Composition | 99% tin, 0.3% silver, 0.7% copper |
| Consumption Unit | 1 pc. bulk |
| Packaging type | Bulk |
| Flux content | 2,5 |
| Melting point | 217 °C |
| Diameter | 1 mm |
| Weight | 100 g |
Po - Št 8:00 - 16:30
Piatok 8:00 - 16:00
