Odspájkovací drôt pre malé spájkované spoje, ktorý je vďaka vynikajúcemu ohybovému správaniu vhodný aj pre ťažko dostupné miesta. Vďaka silnému kapilárnemu pôsobeniu odstraňuje spájkovací knôt roztavenú spájku efektívne a čisto.
| Jednotka spotreby | 1 ks voľne ložené |
| Výška | 10 mm |
| Dĺžka | 50 mm |
| Typ balenia | Hromadné |
| Šírka | 50 mm |
Desoldering wire for small solder joints, which is suitable even for hard-to-reach places thanks to its excellent bending behaviour. Due to strong capillary action, the solder wick removes the molten solder effectively and cleanly.
- Fine copper mesh for removing solder residues and optimal preparation of the solder joint.
- Desoldering wick made of pure copper, oxidation and corrosion-resistant, with good thermal conductivity, low residues, no breakage points
- Helpful tool for removing solder residues. Place the desoldering wire on top of the solder joint and heat with the soldering iron to remove
- Liquefied tin is absorbed by the desoldering braid and removed from the solder joint
- Removes more solder than conventional wicks and helps to correct slight defects on small PCBs
Technical specifications
| Consumption Unit | 1 pc. bulk |
| Packaging type | Bulk |
| Length | 50 mm |
| Width | 50 mm |
| Height | 10 mm |
Po - Št 8:00 - 16:30
Piatok 8:00 - 16:00
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11045330_en_data_scmp.pdf 11045330_en_data_scmp.pdf
